The TSOP Chips Solutions for Memory

base on the semi conducted technical manufacturing experience Himory provide the up-to-date TSOP package and testing solutions with full customized services. The turn-key solutions of TSOP package includes: wafer probing substrate/lead frame design manufacturing design assembly testing EMS etc. With full range testing and production inspection we deliver the TSOP package solution with high reliability and steady performance. Himory TSOP memory products suite well for consumer electronic devices SSD range and USB based products.