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The BGA Memory Chip Solutions

The Ball Grid Array (BGA) are the solution for production of miniature packages for an integrated circuit with hundreds of pins whichprovide the highest contact density of any package type. The BGA packages are with discrete leads (i.e. packages with legs) and with the lower thermal resistance between the package and the PCB.Himory provide BGA package with the NAND flash storage technical solutions which is commonly used in SSD or USB Flash Drive chips.

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Features
Large selection of BGA Packages - Including 25, 56, 64, 100, 132and more ball with customized solutions
High ball counts can accommodate the massive quantity of I/O paths required for highly integrated devices
Reduced package size and height up to 88%-90%area savings on printed circuit board space
The higher in density andefficient heat conduction
High ball counts also allow significant quantities of power and ground paths
Accommodate to high power requirements and reduce inductance for clean power delivery

Specifications

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